Machine Bed

Shuangli Deep Hole Drilling Machine Bed

Engineered for Precision & Durability


Premium Material Selection

  • ​HT300 High-Strength Cast Iron: Combines exceptional vibration damping (damping coefficient ≥0.03) with robust tensile strength (≥300 MPa).
  • ​Microstructural Integrity: Rigorously validated under ​ISO 185 standards to ensure dense graphite morphology and zero shrinkage porosity.

Advanced Process Assurance

  • Stress Elimination: Multi-stage stress relief (annealing, high-frequency oscillation, natural aging) removes >99% residual stress.
  • Stable Microstructure: Precision-controlled cooling rates and alloying elements (Cu, Sn) refine grain structure for uniform mechanical properties.

Built to Last in Extreme Conditions

  • Multi-Layer Protective Coating: Anti-impact, corrosion-resistant, and anti-rust composite spraying technology guarantees longevity in harsh industrial environments.

Advanced Process Assurance

  • Reinforced "工"-Beam Ribs: Longitudinal ribs maximize bending rigidity and load-bearing capacity for heavy-duty operations.
  • ​Honeycomb Cross-Ribs: Lightweight transverse design shifts resonance frequency beyond ​200 Hz, effectively minimizing vibration-induced deformation.

Ultra-Precision Machine Bed

  • Critical Surface Finishing: Guideway mounts, screw holes, and locating holes undergo precision grinding, scraping, and milling to achieve ​micron-level flatness.
  • ​Seamless Assembly: Reference planes and alignment pins ensure stress-free assembly and geometric accuracy across the entire machine tool.

Why Choose Our Deep Hole Drilling Solutions?

✅ ​HT300 Material: Unmatched stability for precision machining.
✅ ​ISO 185-Certified: Guaranteed microstructural quality.
✅ ​Resonance Control: Patented honeycomb ribs for vibration-freeperformance.
✅ ​Industrial-Grade Protection: Engineered to thrive in demanding conditions.

Key Specifications

  • • Damping Coefficient: ≥0.03
  • • Tensile Strength: ≥300 MPa
  • • Resonance Frequency: >200 Hz
  • • Flatness Tolerance: Micron-level
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